NVIDIA and Cisco announce USFP, a pluggable optical module designed for 400Gb/s per lane to scale AI data center networks
NVIDIA and @Cisco introduce pluggable optics to scale AI factories. USFP is the first module to support 400Gb/s per lane, delivering 4x the bandwidth density of today's optics. AI builders can connect more compute to the same switch — no extra network tiers, less power per bit moved. Learn more:
Context
Network bandwidth between GPUs is a growing bottleneck in large AI clusters, so denser optics let builders connect more chips without adding costly extra layers of switches.
NVIDIA and Cisco announced USFP, short for Ultra Dense Small Form Factor Pluggable, at the Open Compute Project summit on October 12. It is a specification still in development, and no sampling or availability date has been announced. Pluggable optics are the swappable modules that convert electrical signals to light in switches and network cards.
Deep dive
On October 12, NVIDIA's newsroom posted that NVIDIA and Cisco are introducing pluggable optics to scale AI factories, saying USFP is the first module to support 400Gb/s per lane and delivers 4x the bandwidth density of today's optics.
According to the joint press release, the first planned USFP transceivers will pack 16 full duplex lanes into a footprint the size of an OSFP module, for 6.4Tb/s per module, with the ability to expand to 32 lanes and 12.8Tb/s. The modules are meant for both switches and SuperNICs. The companies say doubling both lane count and bandwidth per lane lets AI fabrics connect more 1.6Tb/s endpoints without adding network tiers.
The release says USFP uses a new two dimensional connector with a two step insertion design that engages the high speed contacts only after the module is seated, reducing wear and improving signal integrity. Cisco's blog says the format supports both 200G and 400G SerDes systems and offers about 1.3 times better power efficiency.
NAND Research noted that the 1.3 times efficiency figure has no independent measurement yet, that TE Connectivity and Amphenol are involved as connector partners, and that the specification has no availability date.
What to expect next
Watch for a published USFP specification, first module samples and an availability date, none of which have been announced.
Also watch which optics makers and switch vendors beyond NVIDIA and Cisco commit to the format, and whether it competes with or complements co packaged optics, which NVIDIA and others are also pushing for future AI networks. Power and cooling limits in large clusters will shape which approach wins.