The Information: TSMC's Memory Push Is Led by Former Micron Taiwan Head Hsu Kuo-chin
Exclusive: TSMC's memory push is led by Hsu Kuo-chin, a vice president who oversees advanced packaging and previously ran Micron's Taiwan operations. The effort could complicate TSMC's 2024 partnership with SK Hynix on high-bandwidth memory for AI processors. Full story:
Context
If TSMC moves into advanced memory for AI chips, it could change the high bandwidth memory supply chain and strain its partnership with SK Hynix.
The Information reports that TSMC's push into memory is led by Hsu Kuo-chin, a vice president who oversees advanced packaging and previously ran Micron's Taiwan operations. The outlet says TSMC is weighing making advanced memory chips and that the effort could complicate its 2024 partnership with SK Hynix on high bandwidth memory for AI processors. No memory product has been announced.
What to expect next
Watch for TSMC confirming the effort and for SK Hynix's response.